The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2022
Filed:
Apr. 24, 2018
Disco Hi-tec Europe Gmbh, Kirchheim b. Muenchen, DE;
Takatori Corporation, Kashihara, JP;
Karl Heinz Priewasser, Kirchheim b. Muenchen, DE;
Yoshinori Kakinuma, Kashihara, JP;
Yosuke Ishimatsu, Kashihara, JP;
Ken Ikehata, Kashihara, JP;
DISCO HI-TEC EUROPE GMBH, Kirchheim b. Muenchen, DE;
TAKATORI CORPORATION, Kashihara, JP;
Abstract
To reduce residual stress generated on a protective tape at a time of application of the protective tape to a semiconductor wafer, provided is an application apparatus () for applying a protective tape (PT) to a semiconductor wafer (W), including: a tape conveyance mechanism () configured to convey the protective tape (PT) temporarily applied to a base material (BM) to a peeling position; a tape holding body () capable of holding the protective tape (PT); a holding-body moving mechanism () configured to move the tape holding body () to the peeling position; and a peeling mechanism () configured to peel the base material (BM) from the protective tape (PT) held by the tape holding body () at the peeling position.