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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11469099 B1

PDFFull Text
Date of Patent:
Oct. 11, 2022

Filed:

Jun. 18, 2020

Semiconductor package with chip end design and trenches to control fillet spreading in stacked chip packages

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jungmin Ko, Hwaseong-si, KR;

Hyeongmun Kang, Hwaseong-si, KR;

Sangsick Park, Hwaseong-si, KR;

Hyeonjun Song, Hwaseong-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

F. Chau & Associates, LLC

Primary Examiner:

Nicholas J Tobergte

Assistant Examiner:

Tenley H Schofield

Int. Cl.
CPC ...
G11C 5/06 (2006.01); H01L 27/108 (2006.01); H01L 21/02 (2006.01); H01L 21/56 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02304 (2013.01); H01L 21/561 (2013.01); H01L 21/563 (2013.01); H01L 21/76224 (2013.01);
Abstract

A semiconductor package includes a buffer, a chip stack mounted on the buffer, an adhesive layer disposed between the buffer and the chip stack, and a molding material surrounding the chip stack. The buffer includes a plurality of trenches disposed adjacent to a plurality of edges of the buffer. Each of the trenches is shorter than a corresponding adjacent edge of a chip area of the buffer.

Find Patent Forward Citations

Ko, Jungmin. (2022). Semiconductor package with chip end design and trenches to control fillet spreading in stacked chip packages (U.S. Patent No. 11469099). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11469099

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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