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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11466367 B1

PDFFull Text
Date of Patent:
Oct. 11, 2022

Filed:

Sep. 06, 2013

Method for manufacturing product with bright surface

Applicant:

Sankei Giken Kogyo Co., Ltd., Tokyo, JP;

Inventors:

Toshio Okabe, Tokyo, JP;

Shuji Yamamoto, Tokyo, JP;

Daisuke Sato, Tokyo, JP;

Assignee:

SANKEI GIKEN KOGYO CO., LTD., Tokyo, JP;

Attorney:

WHDA, LLP

Primary Examiner:

Nathan H Empie

Int. Cl.
CPC ...
C23C 18/16 (2006.01); B32B 33/00 (2006.01); B32B 38/00 (2006.01); B32B 3/26 (2006.01); B32B 7/12 (2006.01); B32B 15/08 (2006.01); C25D 5/50 (2006.01); C25D 5/12 (2006.01); C25D 5/00 (2006.01); C25D 7/00 (2006.01); C23C 18/30 (2006.01); C23C 18/20 (2006.01); C23C 18/32 (2006.01); C23C 18/48 (2006.01); C25D 3/04 (2006.01); C25D 3/38 (2006.01); C23C 18/28 (2006.01);
U.S. Cl.
CPC ...
C23C 18/1653 (2013.01); B32B 3/266 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 33/00 (2013.01); B32B 38/0004 (2013.01); C23C 18/165 (2013.01); C23C 18/1641 (2013.01); C23C 18/1692 (2013.01); C25D 5/12 (2013.01); C25D 5/50 (2013.01); C25D 5/505 (2013.01); C25D 5/625 (2020.08); C25D 5/627 (2020.08); C25D 7/00 (2013.01); B32B 2307/406 (2013.01); B32B 2307/714 (2013.01); B32B 2605/08 (2013.01); C23C 18/204 (2013.01); C23C 18/2086 (2013.01); C23C 18/285 (2013.01); C23C 18/30 (2013.01); C23C 18/32 (2013.01); C23C 18/48 (2013.01); C25D 3/04 (2013.01); C25D 3/38 (2013.01);
Abstract

A method of manufacturing a bright surface product comprises a step of performing electroless plating to form a first metal film on a base coat layer formed on a substrate, a step of performing electrolytic plating to form a second metal film thereon so that the bonding strength between each film of a multi-layered metal film comprising the first metal film and the second film is higher than the bonding strength between the base coat layer and the first metal layer, a step of integrally and discontinuously segmentalizing the multi-layered metal film with cracks to form an island-like metal film comprising a collection of fine multi-layered metal regions with island-like structures; and a step of forming a translucent top coat layer to cover the fine multi-layered metal regions of the island-like metal film and enter into the cracks to make contact with the base coat layer.

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