The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2022
Filed:
Jun. 18, 2021
National Tsing Hua University, Hsinchu, TW;
Jien-Wei Yeh, Hsinchu, TW;
National Tsing Hua University, Hsinchu, TW;
Abstract
A high strength and low modulus alloy is disclosed, and comprises at least five principal elements and at least one additive element. The principal elements are Ti, Zr, Nb, Mo, and Sn, and the additive element(s) are V, W, Cr, and/or Hf. Particularly, a summation of numeric values of Ti and Zr in atomic percent is less than or equal to 85, and the additive elements have a total numeric value in atomic percent less than or equal to 4. Experimental data reveal that, samples of the high strength and low modulus alloy all have properties of yield strength greater than 600 MPa and Young's modulus less than 90 GPa. As a result, experimental data have proved that the high strength and low modulus alloy has a significant potential for applications in the manufacture of various industrial components and/or devices, medical devices, and surgical implants.