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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11466181 B1

PDFFull Text
Date of Patent:
Oct. 11, 2022

Filed:

Jun. 25, 2021

Metal particle-containing composition and electrically conductive adhesive film

Applicant:

Furukawa Electric Co., Ltd., Tokyo, JP;

Inventors:

Norzafriza Nitta, Tokyo, JP;

Tomohiro Ishii, Tokyo, JP;

Hidemichi Fujiwara, Tokyo, JP;

Assignee:

Furukawa Electric Co., Ltd., Tokyo, JP;

Attorney:

Dorsey & Whitney LLP

Primary Examiner:

Khanh T Nguyen

Int. Cl.
CPC ...
C09J 9/02 (2006.01); C09J 7/35 (2018.01); C09J 11/06 (2006.01); C09J 179/08 (2006.01); C22C 13/02 (2006.01); B23K 35/26 (2006.01); C08K 3/08 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C09J 7/35 (2018.01); C09J 11/06 (2013.01); C09J 179/08 (2013.01); C22C 13/02 (2013.01); B23K 35/262 (2013.01); C08K 2003/085 (2013.01); C08K 2003/0806 (2013.01); C08K 2003/0831 (2013.01); C08K 2003/0856 (2013.01); C08K 2003/0862 (2013.01); C08K 2003/0893 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01); C08K 2201/011 (2013.01); C09J 2203/326 (2013.01); C09J 2301/304 (2020.08); C09J 2301/408 (2020.08); C09J 2479/08 (2013.01);
Abstract

The present disclosure relates to a metal particle-containing composition contains at least one thermosetting resin (R), a hardening agent (H), and at least three types of metal particles (P) different from one another. The metal particles (P) contain a solder alloy particle (P1) containing a tin alloy containing at least one metal (A), wherein the metal (A) is a metal that forms a eutectic crystal with tin at a eutectic temperature of 200° C. or lower, at least one metal particle (P2) containing a metal (B) having a melting point exceeding 420° C. in a bulk, the metal particle (P2) having a melting point higher than a solidus temperature of the solder alloy particle (P1), and at least one metal particle (P3) containing a metal (C) that forms an intermetallic compound with a metal contained in the solder alloy particle (P1).

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