The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2022
Filed:
Jun. 13, 2018
The Boeing Company, Chicago, IL (US);
Austin E. Mann, St. Louis, MO (US);
Ali Yousefiani, Tustin, CA (US);
The Boeing Company, Chicago, IL (US);
Abstract
An interlayered structure for joining of dissimilar materials, includes a first material substrate, a second material substrate having a composition dissimilar from a composition of the first material substrate, and a plurality of interlayers disposed between the first material substrate and the second material substrate, including a first interlayer nearest to the first material substrate and a last interlayer nearest to the second material substrate. The first interlayer has a composition selected to have a maximum solid solubility within the composition of the first material substrate that is greater than or equal to the other interlayers' solubility within the composition of the first material substrate. The last interlayer has a composition selected to have a maximum solid solubility within the composition of the second material substrate that is greater than or equal to the other interlayers' solubility within the composition of the second material substrate. At least one of the plurality of interlayers is a sintered powder interlayer.