The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2022
Filed:
Jan. 24, 2019
Applicant:
Kyocera Corporation, Kyoto, JP;
Inventor:
Keizou Sakurai, Yasu, JP;
Assignee:
KYOCERA CORPORATION, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 9/00 (2006.01); H01L 23/13 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H05K 1/02 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0242 (2013.01); H01Q 1/2283 (2013.01);
Abstract
A wiring substrate comprises a first substrate, a second substrate which includes a frame body located on the outer circumferential edge of the first substrate, at least two connecting parts connected to the inner circumferential part of the frame body, and a support body connecting the two connecting parts to each other, and a third substrate located on a surface of the second substrate opposite the first substrate. The support body includes a direction changing part between the two connecting parts and does not include an annular structure where the direction changing part is included on the circumference.