The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2022

Filed:

Mar. 27, 2020
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Yusuke Naniwa, Kyoto, JP;

Hideki Muto, Kyoto, JP;

Hiroshi Nishikawa, Kyoto, JP;

Takashi Watanabe, Kyoto, JP;

Akiko Itabashi, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/187 (2006.01); H03F 3/195 (2006.01); H04B 1/403 (2015.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H03F 3/195 (2013.01); H04B 1/406 (2013.01); H05K 1/165 (2013.01);
Abstract

A radio frequency circuit includes a substrate, a first terminal disposed on a first principal surface of the substrate, a second terminal disposed on the first principal surface, a first-surface mounted component disposed on the first principal surface or inside the substrate, and a second-surface mounted component disposed on a second principal surface of the substrate which is opposite the first principal surface. A radio-frequency signal, which is input to the first terminal, is transmitted, for output from the second terminal, so as to make at least one round trip between the first principal surface and the second-surface mounted component, which is disposed on the second principal surface, through wiring lines disposed in the substrate.


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