The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2022

Filed:

Oct. 22, 2019
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Seunghan Seo, Suwon-si, KR;

Jongpil Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01R 12/77 (2011.01); H01Q 21/06 (2006.01); H01R 12/79 (2011.01); H01Q 5/314 (2015.01); H01R 12/62 (2011.01);
U.S. Cl.
CPC ...
H01R 12/775 (2013.01); H01Q 1/38 (2013.01); H01Q 5/314 (2015.01); H01Q 21/06 (2013.01); H01R 12/62 (2013.01); H01R 12/79 (2013.01);
Abstract

According to various embodiments, an electronic device may include a housing including a first plate, a second plate facing away from the first plate, and a side housing surrounding a space between the first plate and the second plate and joined to the second plate or provided integrally with the second plate, a display viewable through at least part of the first plate, a first Printed Circuit Board (PCB) disposed between the first plate and the second plate and including at least one first ground layer, a Flexible Printed Circuit Board (FPCB) at least partially overlapping the first PCB when viewed from above the first plate and including a first end electrically coupled to the first PCB, a second end, and at least one second ground layer, and a conductive structure comprising a conductive material disposed between the first PCB and the FPCB and electrically coupling the first ground layer and the second ground layer.


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