The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2022
Filed:
Sep. 28, 2017
3m Innovative Properties Company, St. Paul, MN (US);
Kok Hoe Lee, Singapore, SG;
Saujit Bandhu, Singapore, SG;
Yunlong Qiao, Singapore, SG;
Rao L. Vittapalli, Singapore, SG;
3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US);
Abstract
A connector assembly for mounting on and making solderless electrical contact with a printed circuit board includes a plurality of stacked wafer assemblies. Each wafer assembly includes a wafer, a plurality of terminals partially embedded in the wafer where each terminal includes a connecting portion embedded in the wafer, a resiliently compressible mating portion for making solderless contact with a corresponding conductive pad of a PCB and a contact portion. The wafer is molded over the terminals. The wafer assembly also includes a plurality of wires terminated in termination regions at the contact portions of the terminals, and a shield disposed in the recess of the wafer and extending across the wafer. The connector assembly further includes a housing molded over the stacked wafers and the termination regions.