The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2022

Filed:

May. 17, 2019
Applicants:

Autonetworks Technologies, Ltd., Mie, JP;

Sumitomo Wiring Systems, Ltd., Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Yuji Kawata, Mie, JP;

Kenji Miyamoto, Mie, JP;

Daichi Shirai, Mie, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/00 (2006.01); H01R 4/62 (2006.01); H01B 1/02 (2006.01); H01R 4/02 (2006.01); H01R 43/02 (2006.01); H02G 1/14 (2006.01); H02G 15/02 (2006.01);
U.S. Cl.
CPC ...
H01R 4/625 (2013.01); H01B 1/02 (2013.01); H01R 4/021 (2013.01); H01R 43/0207 (2013.01); H02G 1/14 (2013.01); H02G 15/02 (2013.01);
Abstract

A harness is provided with one or more first wires each including a first core exposed portion, one or more second wires each including a second core exposed portion, and a bonded portion formed by welding the first and second core exposed portion(s). A total cross-sectional area of the second core(s) is equal to or less than ⅓ of the sum of total cross-sectional areas of the first and second core(s). The bonded portion has two pairs of outer surfaces extending along an extending direction of the first and second wires and facing each other and a distance H between one pair of the outer surfaces (upper/lower surfaces), out of the two pairs of outer surfaces, is longer than a distance W between another pair of the outer surfaces (right/left side surfaces). The second core exposed portion(s) is/are arranged adjacent to the upper surface Up in the bonded portion.


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