The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2022

Filed:

Nov. 23, 2020
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Ryu Kamibaba, Tokyo, JP;

Shinya Soneda, Tokyo, JP;

Tetsuya Nitta, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/08 (2006.01); H01L 29/06 (2006.01); H01L 29/739 (2006.01); H01L 29/66 (2006.01); H01L 29/45 (2006.01); H01L 29/861 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0834 (2013.01); H01L 29/0619 (2013.01); H01L 29/0696 (2013.01); H01L 29/456 (2013.01); H01L 29/66348 (2013.01); H01L 29/7397 (2013.01); H01L 29/861 (2013.01);
Abstract

Provided is a semiconductor device having improved breakdown resistance during recovery operation. A semiconductor device according to the present application is a semiconductor device in which an insulated gate bipolar transistor region and a diode region are provided adjacent to each other. The insulated gate bipolar transistor region includes an emitter layer having a short-side direction in a first direction in a plan view. The diode region includes carrier injection suppression layer having a short-side direction in a second direction in a plan view. In a plan view, a width of the carrier injection suppression layer in the second direction is smaller than a width of the emitter layer in the first direction.


Find Patent Forward Citations

Loading…