The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2022
Filed:
Oct. 28, 2020
Samsung Electronics Co., Ltd., Suwon-si, KR;
Unist (Ulsan National Institute of Science and Technology), Ulsan, KR;
Hyeonjin Shin, Suwon-si, KR;
Minhyun Lee, Suwon-si, KR;
Changseok Lee, Gwacheon-si, KR;
Hyeonsuk Shin, Ulsan, KR;
Seokmo Hong, Ulsan, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
UNIST (Ulsan National Institute of Science and Technology), Ulsan, KR;
Abstract
An interconnect structure and an electronic apparatus including the interconnect structure are provided. The interconnect structure includes a conductive layer; a dielectric layer configured to surround at least a part of the conductive layer; and a diffusion barrier layer disposed between the conductive layer and the dielectric layer and configured to limit and/or prevent a conductive material of the conductive layer from diffusing into the dielectric layer, and at least one of the dielectric layer and the diffusion barrier layer includes a boron nitride layer of a low dielectric constant.