The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2022
Filed:
Aug. 26, 2019
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/13 (2006.01); H01L 25/18 (2006.01); H01L 23/538 (2006.01); G01L 9/00 (2006.01); G01H 3/00 (2006.01); G01K 13/02 (2021.01); G01N 33/00 (2006.01); G01K 13/024 (2021.01);
U.S. Cl.
CPC ...
H01L 23/13 (2013.01); G01H 3/00 (2013.01); G01K 13/02 (2013.01); G01L 9/0041 (2013.01); G01N 33/0027 (2013.01); H01L 23/5389 (2013.01); H01L 25/18 (2013.01); G01K 13/024 (2021.01);
Abstract
A sensor package substrate disclosed in the present specification has a mounting area in which a sensor chip is mounted and a controller chip connected to the sensor chip. A through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the substrate from one surface to the other surface thereof. The mounting area and the controller chip overlap each other in a plan view. According to the present invention, by reducing the thickness of an insulating layer, it is possible not only to reduce the distance of a wiring for the sensor chip and controller chip, but also to reduce the area of the substrate.