The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2022

Filed:

Jun. 02, 2014
Applicant:

Hitachi Kokusai Electric Inc., Tokyo, JP;

Inventors:

Kosuke Takagi, Toyama, JP;

Naonori Akae, Toyama, JP;

Masato Terasaki, Toyama, JP;

Mikio Ohno, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/67 (2006.01); C23C 16/40 (2006.01); C23C 16/455 (2006.01); C23C 16/30 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0262 (2013.01); C23C 16/308 (2013.01); C23C 16/402 (2013.01); C23C 16/403 (2013.01); C23C 16/405 (2013.01); C23C 16/45523 (2013.01); C23C 16/45534 (2013.01); H01J 37/32449 (2013.01); H01L 21/67109 (2013.01); H01L 21/02532 (2013.01);
Abstract

There is provided a substrate processing apparatus including: a process chamber configured to accommodate and process a plurality of substrates arranged with intervals therebetween; a first nozzle extending along a stacking direction of the substrates and configured to supply a hydrogen-containing gas into the process chamber; and a second nozzle extending along the stacking direction of the substrates and configured to supply an oxygen-containing gas into the process chamber, wherein the first nozzle includes a plurality of first gas supply holes disposed in a region extending from an upper portion to a lower portion of the first nozzle corresponding to a substrate arrangement region where the substrates are arranged, and the second nozzle includes a plurality of second gas supply holes disposed at an upper portion and a lower portion of the second nozzle to correspond to upper substrates and lower substrates of the substrates.


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