The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2022
Filed:
Oct. 24, 2017
Mitsubishi Electric Corporation, Chiyoda-ku, JP;
Hiroyuki Chibahara, Chiyoda-ku, JP;
MITSUBISHI ELECTRIC CORPORATION, Chiyoda-ku, JP;
Abstract
Provided is a method of manufacturing a contact material, including the steps of: forming a Ni alloy film having a film thickness of 40 nm or more and 110 nm or less on a surface of WC powder having an average particle diameter of 2 μm or more and 10 μm or less by an electroless Ni plating method; performing heat treatment for degassing at a temperature of 500° C. or more and 860° C. or less; crushing Ni alloy-coated WC powder after the heat treatment; mixing the crushed Ni alloy-coated WC powder and Cu powder having an average particle diameter of 1 μm or more and 100 μm or less; and compressing the resultant mixture, followed by sintering the mixture at a temperature of more than 1,083° C. and less than 1,455° C.