The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2022

Filed:

Aug. 05, 2019
Applicant:

Beijing Kuangshi Technology Co., Ltd., Beijing, CN;

Inventors:

Zhiri Cao, Beijing, CN;

Mu Yang, Beijing, CN;

Keqing Chen, Beijing, CN;

Zhixian Liu, Beijing, CN;

Yan Gao, Beijing, CN;

Zhe Yang, Beijing, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06T 7/521 (2017.01); G06T 7/593 (2017.01); H04N 5/225 (2006.01); H04N 5/247 (2006.01); G06V 10/60 (2022.01); G06V 10/75 (2022.01); G06K 9/62 (2022.01);
U.S. Cl.
CPC ...
G06T 7/521 (2017.01); G06K 9/6215 (2013.01); G06T 7/593 (2017.01); G06V 10/60 (2022.01); G06V 10/757 (2022.01); H04N 5/2256 (2013.01); H04N 5/247 (2013.01); G06T 2207/10024 (2013.01); G06T 2207/10028 (2013.01); G06T 2207/10048 (2013.01);
Abstract

Disclosed are an image processing method and apparatus, and an image processing device. According to the image processing method and apparatus, and the image processing device, an infrared binocular camera collects images formed when a measured object is illuminated by a speckle pattern projected by a projection assembly to obtain a first image collected by a first camera and a second image collected by a second camera; and three-dimensional data of the measured object is determined according to a pair of images constituted by the first image and the second image. By means of the method, three-dimensional data of a measured object can be relatively accurately obtained through measurement, thereby improving precision and accuracy of measurement, and also precision requirements for a projection assembly are low, so that costs can be lowered.


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