The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2022

Filed:

Dec. 17, 2019
Applicant:

Ams Sensors Singapore Pte. Ltd, Singapore, SG;

Inventors:

Guo Xiong Wu, Singapore, SG;

Ming Jie Lee, Singapore, SG;

Simon Gubser, Weesen, CH;

Qichuan Yu, Singapore, SG;

Joon Heng Tan, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 7/00 (2021.01); G02B 13/16 (2006.01); H01L 31/0232 (2014.01); H01L 31/18 (2006.01); H01S 5/0225 (2021.01); G02B 5/20 (2006.01); G02B 13/00 (2006.01); H01L 27/146 (2006.01); H01L 31/0203 (2014.01); H01L 33/50 (2010.01); H01L 33/52 (2010.01); H01L 33/58 (2010.01); G02B 5/28 (2006.01);
U.S. Cl.
CPC ...
G02B 7/006 (2013.01); G02B 5/20 (2013.01); G02B 13/0085 (2013.01); G02B 13/16 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H01L 27/14685 (2013.01); H01L 31/0203 (2013.01); H01L 31/02325 (2013.01); H01L 31/02327 (2013.01); H01L 31/1876 (2013.01); H01L 33/507 (2013.01); H01L 33/52 (2013.01); H01L 33/58 (2013.01); H01S 5/0225 (2021.01); G02B 5/201 (2013.01); G02B 5/208 (2013.01); G02B 5/28 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01);
Abstract

The present disclosure describes optical and optoelectronic assemblies that, in some cases, include screen-printed micro-spacers, as well as methods for manufacturing such assemblies and modules. For example, an optoelectronic device mounted on a substrate can include an optical sub-assembly including a first optical element and a first micro-spacer on the optical element. The optical sub-assembly can be disposed over the optoelectronic device, with a first air or vacuum gap separating the first optical element from the optoelectronic device, and the first micro-spacer laterally surrounding the first air or vacuum gap.


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