The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2022

Filed:

Apr. 27, 2021
Applicant:

Silicon Laboratories Inc., Austin, TX (US);

Inventors:

Wenshui Zhang, Singapore, SG;

Wei Jue Lim, Singapore, SG;

Assignee:

Silicon Laboratories Inc., Austin, TX (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/02 (2006.01); G01R 1/04 (2006.01); G01R 1/067 (2006.01); G01R 1/073 (2006.01); G01R 31/26 (2020.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2887 (2013.01); G01R 1/0441 (2013.01);
Abstract

A test system for high voltage testing of semiconductor devices including at least one test socket and a docking plate assembly. Each test socket includes a socket enclosure for encompassing first and second contact finger assemblies, in which the socket enclosure may include a cover and alignment plate. At least one test socket is embedded within the docking plate assembly which is configured to mount between high voltage test head and a pick and place handler. The docking plate assembly and each test socket includes one or more site openings each for receiving a corresponding device under test (DUT) during a high voltage test procedure. Each contact finger assembly includes at least one contact finger configured as an elongated conductor with a bent tip for electrically interfacing a pad of the DUT.


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