The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2022

Filed:

Oct. 18, 2018
Applicant:

Formfactor, Inc., Livermore, CA (US);

Inventors:

Jason William Cosman, Livermore, CA (US);

Benjamin N. Eldridge, Danville, CA (US);

Eric Hill, Portland, OR (US);

John Ebner, Portland, OR (US);

Edin Sijercic, Portland, OR (US);

Assignee:

FormFactor, Inc., Livermore, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 1/073 (2006.01); G01R 3/00 (2006.01); H03H 7/38 (2006.01); G01R 1/067 (2006.01);
U.S. Cl.
CPC ...
G01R 1/07342 (2013.01); G01R 1/07314 (2013.01); G01R 1/07371 (2013.01); G01R 3/00 (2013.01); H03H 7/38 (2013.01); G01R 1/06772 (2013.01);
Abstract

Improved electrically conductive guide plates for vertical probe arrays are provided by patterning a thin metal layer disposed on an insulating substrate. Holes passing through the guide plate for guiding probes can be electrically connected or isolated from each other in any pattern according to the deposition of the metal. Such structures can include several distinct ground and/or voltage planes. Furthermore, passive electrical components can be included in the guide plate, by patterning of the deposited metal and/or by integration of passive electrical components with the deposited metal traces.


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