The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2022

Filed:

Feb. 05, 2021
Applicant:

Analog Devices International Unlimited Company, Limerick, IE;

Inventors:

Jochen Schmitt, Biedenkopf, DE;

Michael J. Cusack, Newmarket-on-Fergus, IE;

Enda Joseph Nicholl, Kilmallock, IE;

Brian O'Mara, Lisnagry, IE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01D 5/16 (2006.01); H01L 43/02 (2006.01); H01L 43/08 (2006.01); G01R 33/09 (2006.01); B62D 5/04 (2006.01); H02K 11/215 (2016.01);
U.S. Cl.
CPC ...
G01D 5/16 (2013.01); G01R 33/093 (2013.01); G01R 33/096 (2013.01); G01R 33/098 (2013.01); H01L 43/02 (2013.01); H01L 43/08 (2013.01); B62D 5/046 (2013.01); H02K 11/215 (2016.01);
Abstract

A magnetic field sensor package is disclosed. The package includes a substrate that has a front side and a back side opposite the front side. The substrate can comprise a lead frame. The package also includes a first magnetic field sensor die that is electrically and mechanically mounted on the front side of the substrate. The package also includes a second magnetic field sensor die that is electrically and mechanically mounted on the front side of the substrate. The package further includes a magnet that is disposed on the back side of the substrate. The magnet can provide a bias field for the first magnetic field sensor die and the second magnetic field sensor die. The package can also include a molding material that is disposed about the lead frame, the first magnetic field sensor die, the second magnetic field sensor die, and the magnet.


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