The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2022
Filed:
Feb. 07, 2020
Ebm-papst St. Georgen Gmbh & Co. KG, St. Georgen, DE;
Volker Ehlers, St. Georgen, DE;
Ralf-Michael Sander, St. Georgen, DE;
ebm-papst St. Georgen GmbH & Co. KG, St. Georgen, DE;
Abstract
A printed circuit board module () has a printed circuit board () with a first side (), a second side () and a contact hole (). A sleeve-type via () is provided in the contact hole. An annular ring () is associated with the via (), on at least one side (). The annular ring () is arranged on the first side () or on the second side () of the printed circuit board (). The annular ring () is electrically connected to the via (). The annular ring () has an annular ring edge (), at least in sections. The printed circuit board module () has a solder resist layer (). It extends, at least in sections, from outside the annular ring edge () over the annular ring edge () to an outer region () of the annular ring (). An inner region () not covered with the solder resist layer (), remains on the annular ring ().