IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11459634 B1

PDFFull Text
Date of Patent:
Oct. 04, 2022

Filed:

Jun. 21, 2018

Method for manufacturing stress-relief-annealing-resistant, low-iron-loss grain-oriented silicon steel

Applicant:

Baoshan Iron & Steel Co., Ltd., Shanghai, CN;

Inventors:

Shuangjie Chu, Shanghai, CN;

Guobao Li, Shanghai, CN;

Yongjie Yang, Shanghai, CN;

Zipeng Zhao, Shanghai, CN;

Changsong Ma, Shanghai, CN;

Kanyi Shen, Shanghai, CN;

Meihong Wu, Shanghai, CN;

Yaming Ji, Shanghai, CN;

Huabing Zhang, Shanghai, CN;

Zhuochao Hu, Shanghai, CN;

Assignee:

BAOSHAN IRON & STEEL CO., LTD., Shanghai, CN;

Attorney:

Amster, Rothstein & Ebenstein LLP

Primary Examiner:

Vanessa T Luk

Int. Cl.
CPC ...
C21D 9/46 (2006.01); C21D 1/30 (2006.01); C21D 8/12 (2006.01); B23K 26/0622 (2014.01); B23K 26/082 (2014.01); B23K 26/06 (2014.01); C22C 38/00 (2006.01); C22C 38/02 (2006.01); C22C 38/04 (2006.01); C22C 38/06 (2006.01); H01F 41/02 (2006.01);
U.S. Cl.
CPC ...
C21D 9/46 (2013.01); B23K 26/0604 (2013.01); B23K 26/0622 (2015.10); B23K 26/082 (2015.10); C21D 1/30 (2013.01); C21D 8/1222 (2013.01); C21D 8/1233 (2013.01); C21D 8/1255 (2013.01); C21D 8/1283 (2013.01); C22C 38/001 (2013.01); C22C 38/002 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); H01F 41/02 (2013.01);
Abstract

Disclosed is a method for manufacturing stress-relief-annealing-resistant, low-iron-loss grain-oriented silicon steel, the method comprising: carrying out, by means of a pulse laser, scanning grooving on a single surface or two surfaces of a silicon steel sheet after cold rolling, or after decarburizing annealing, or after high temperature annealing or after hot stretching, temper rolling and annealing, and forming several grooves parallel with each other in a rolling direction of the silicon steel sheet, wherein a single pulse time width of the pulse laser is 100 ns or less, and a single pulse peak energy density is 0.05 J/cmor more; the energy density of a single scan of a single laser beam is 1 J/cmto 100 J/cm; a beam spot of the pulse laser is a single beam spot or a combination of a plurality of beams spots, the shape of the beam spot is circular or elliptic, and the diameter of the beam spot in a scanning direction is 5 μm to 1 mm, and the diameter thereof in a direction perpendicular to the scanning direction is 5 μm to 300 μm; and when scanning grooving is carried out at the same position on the silicon steel sheet, the product of the number of beam spots of the pulse laser and the scan times is 5 or more.

Find Patent Forward Citations

Loading…