The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2022

Filed:

Dec. 31, 2018
Applicant:

Lotte Chemical Corporation, Seoul, KR;

Inventors:

Kyoung Ju Kim, Uiwang-si, KR;

Kee Hae Kwon, Uiwang-si, KR;

Myung Hun Kim, Uiwang-si, KR;

Jung Woo Park, Uiwang-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 69/00 (2006.01); C08L 51/00 (2006.01); C08L 51/06 (2006.01);
U.S. Cl.
CPC ...
C08L 69/00 (2013.01); C08L 51/003 (2013.01); C08L 51/06 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01);
Abstract

A thermoplastic resin composition for plating of the present invention comprises: about 35 wt % to about 60 wt % of a polycarbonate resin; about 1 wt % to about 20 wt % of a first rubber modified vinyl graft copolymer; about 5 wt % to about 30 wt % of a second rubber modified vinyl graft copolymer; and about 25 wt % to about 50 wt % of an aromatic vinyl copolymer resin, wherein the first rubber modified aromatic vinyl graft copolymer and the second rubber modified aromatic vinyl graft copolymer are present in a weight ratio of about 1:1 to about 1:10. The thermoplastic resin composition for plating and a plated molded product comprising the same have good etching property, plating adhesion, impact resistance, heat resistance and the like.


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