The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2022
Filed:
Sep. 11, 2017
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Yasuo Yamaguchi, Tokyo, JP;
Mika Okumura, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01P 15/125 (2006.01); B81B 3/00 (2006.01); B81B 7/00 (2006.01); G01P 1/02 (2006.01); G01P 15/08 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0008 (2013.01); B81B 3/001 (2013.01); B81B 7/0041 (2013.01); B81B 7/0077 (2013.01); G01P 1/023 (2013.01); G01P 15/0802 (2013.01); G01P 15/0888 (2013.01); G01P 15/125 (2013.01); B81B 2201/0235 (2013.01);
Abstract
A semiconductor device includes a substrate, a movable portion provided on the substrate, a junction frame provided on the substrate to surround the movable portion, a cap bonded to the junction frame, the cap having a recessed portion and covering a space over the movable portion with the recessed portion facing the movable portion, the cap having an inside wall provided with irregularities, and a prevention film formed on the inside wall of the cap, the prevention film having irregularities on a surface thereof.