The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2022
Filed:
Jul. 12, 2019
Applicant:
Jsp Corporation, Tokyo, JP;
Inventors:
Shota Takagi, Fuji, JP;
Akinobu Hira, Yokkaichi, JP;
Assignee:
JSP CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 27/08 (2006.01); B32B 3/30 (2006.01); B32B 7/022 (2019.01); B32B 5/22 (2006.01); B32B 5/32 (2006.01); B29K 23/00 (2006.01);
U.S. Cl.
CPC ...
B32B 27/08 (2013.01); B32B 3/30 (2013.01); B32B 5/22 (2013.01); B32B 5/32 (2013.01); B32B 7/022 (2019.01); B29K 2023/16 (2013.01); B32B 2250/02 (2013.01); B32B 2264/203 (2020.08); B32B 2274/00 (2013.01); B32B 2307/54 (2013.01); B32B 2307/72 (2013.01);
Abstract
A laminated article includes a thermoplastic resin expanded beads molded layer A having a volume Va and a tensile modulus TMa which is 2 to 100 MPa, and a thermoplastic elastomer expanded beads molded layer B having a volume Vb and a tensile modulus TMb which is 0.05 MPa or more and less than 2 MPa, the layers A and B being laminated and bonded to each other. Va:Vb is 90:10 to 50:50 and TMb/TMa is 0.025 or less.