The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2022

Filed:

Apr. 24, 2018
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Pol Fornos Martinez, Sant Cugal del Valles, ES;

Ismael Fernandez Aymerich, Sant Cugat del Valles, ES;

Manuel Freire Garcia, Sant Cugat del Valles, ES;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 19/00 (2018.01); B29C 64/393 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B29C 64/165 (2017.01);
U.S. Cl.
CPC ...
B29C 64/393 (2017.08); B29C 64/165 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12);
Abstract

In certain examples, a method comprises determining a fusing area density distribution of a build layer from build data relating to a build layer of a three-dimensional model to be printed by an additive manufacturing system. The method comprises, in response to a determination that a region of the build layer has a fusing area density outside of a fusing area density tolerance window, modifying the build layer to define a build layer in which the region has a fusing area density that is within the fusing area density tolerance window.


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