The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2022
Filed:
Mar. 03, 2020
Seiren Co., Ltd., Fukui, JP;
Shigeru Nakajima, Fukui, JP;
Nobuyuki Aoki, Fukui, JP;
Abstract
An embossing die is provided to an embossing apparatus. The embossing die is heated by a heating unit which is provided to the embossing apparatus. The embossing die includes a convex shaped mold portion. The mold portion corresponds to one concave portion formed on a front face of a base material. The mold portion is an aggregate of a plurality of protrusions which are divided by a slit. The slit is provided to an outer surface of the mold portion which contacts the front face of the base material. In the slit, a cutting direction corresponds to a height direction of the mold portion. The plurality of protrusions are adjacent to each other through the slit.