The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2022

Filed:

Jan. 31, 2020
Applicant:

Ii-vi Delaware, Inc., Wilmington, DE (US);

Inventor:

Mikhail A. Vorontsov, Dayton, OH (US);

Assignee:

II-VI DELAWARE, INC., Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/03 (2006.01); H01S 3/23 (2006.01); H01S 3/067 (2006.01); H01S 3/00 (2006.01); B23K 26/342 (2014.01); B23K 26/06 (2014.01); B23K 26/082 (2014.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B23K 26/044 (2014.01); B23K 26/08 (2014.01); B23K 26/00 (2014.01); B23K 26/067 (2006.01);
U.S. Cl.
CPC ...
B23K 26/032 (2013.01); B23K 26/0006 (2013.01); B23K 26/044 (2015.10); B23K 26/0608 (2013.01); B23K 26/0626 (2013.01); B23K 26/0676 (2013.01); B23K 26/082 (2015.10); B23K 26/0876 (2013.01); B23K 26/342 (2015.10); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); H01S 3/005 (2013.01); H01S 3/0071 (2013.01); H01S 3/067 (2013.01); H01S 3/2383 (2013.01); H01S 3/0014 (2013.01);
Abstract

A system for LAM that uses a scalable array of individually controllable laser beams that are generated by a fiber array system to process materials into an object using a powder bed, wire feed, or direct deposition. The adaptive control of individual beams may include beam power, focal spot width, centroid position, scanning orientation, amplitude and frequency, piston phase and polarization states of individual beams. These characteristics can be independently adjusted to control LAM characteristics including microstructure, mechanical and surface quality characteristics. The system may also have a set of material sensors that gather information on a material and environment immediately before, during, and immediately after processing. This information can be used to adapt the material processing routine to improve LAM productivity and parts quality. The system also supports a variety of beam shaping methods that improve the quality of produced objects or mitigate processing issues.


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