The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2022

Filed:

Mar. 26, 2019
Applicants:

The Regents of the University of California, Oakland, CA (US);

Hypothermia Devices, Inc., Los Angeles, CA (US);

Inventors:

Julio L. Vergara, Los Angeles, CA (US);

Daniel M. Estrada, Los Angeles, CA (US);

Mayank Kalra, Los Angeles, CA (US);

Andrew Padula, Laguna Niguel, CA (US);

Daniel E. Cuadra, Los Angeles, CA (US);

Ryan C. Cohn, Los Angeles, CA (US);

Assignees:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61F 7/00 (2006.01); A61F 7/08 (2006.01); A61F 7/02 (2006.01);
U.S. Cl.
CPC ...
A61F 7/0053 (2013.01); A61F 7/08 (2013.01); A61F 2007/0008 (2013.01); A61F 2007/0054 (2013.01); A61F 2007/0056 (2013.01); A61F 2007/0075 (2013.01); A61F 2007/0076 (2013.01); A61F 2007/0096 (2013.01); A61F 2007/0233 (2013.01); A61F 2007/0234 (2013.01);
Abstract

A heat exchange module having a heat transfer fluid channel and a heat transfer plate in heat transfer relation with fluid in the channel. The reference side of a thermoelectric cooler (TEC) is in thermal contact with the plate. A heat transfer tile is in thermal contact with a user side of the TEC. The module is configured to be operatively positionable with the tile in heat transfer relation with skin of a patient.


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