The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2022

Filed:

Dec. 12, 2019
Applicant:

Tatsuta Electric Wire & Cable Co., Ltd., Osaka, JP;

Inventors:

Yuusuke Haruna, Kizugawa, JP;

Shirou Yamauchi, Kizugawa, JP;

Hiroshi Tajima, Kizugawa, JP;

Sougo Ishioka, Kizugawa, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0219 (2013.01); H05K 1/115 (2013.01); H05K 3/0094 (2013.01); H05K 2201/05 (2013.01);
Abstract

Provided is a shielded printed wiring board that exhibits excellent connection stability even when having a through-hole with a small opening area, and enables a high degree of freedom in circuit design. The shielded printed wiring boardaccording to the present invention includes a printed wiring board, an insulating layer, and a conductive adhesive layerdisposed between the printed wiring boardand the insulating layer. The printed wiring boardincludes a base, a circuit patterndisposed on the base, and an insulating protective layercovering the circuit pattern. The shielded printed wiring board has a through-holefor external grounding that vertically penetrates the insulating layerand the conductive adhesive layer. The conductive adhesive layerhas an extensionextending toward the inside of the through-holeas compared with the insulating layer


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