The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2022

Filed:

Jan. 22, 2020
Applicant:

Antwave Intellectual Property Limited, Hong Kong, CN;

Inventors:

Kung Bo Ng, Hong Kong, CN;

Chun Kai Leung, Hong Kong, CN;

Hang Wong, Hong Kong, CN;

Chi Sun Yu, Hong Kong, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 13/10 (2006.01); H04B 3/52 (2006.01); H01P 3/16 (2006.01); H01Q 1/38 (2006.01); H01Q 13/24 (2006.01); H01P 3/10 (2006.01);
U.S. Cl.
CPC ...
H04B 3/52 (2013.01); H01P 3/10 (2013.01); H01P 3/16 (2013.01); H01Q 1/38 (2013.01); H01Q 13/24 (2013.01);
Abstract

A slotted electrically conductive structure attachable to a substrate and configured to enhance penetration of an incidental radio wave through the substrate is disclosed. The structure allows a substantial portion of the incidental radio wave to penetrate from a first region to a second region through the substrate. The slotted electrically conductive structure comprises a metallic base layer of transparent metal or metal oxide; and one or more patterned slots provided on the metallic base layer. Each of the patterned slots comprises a plurality of feature elements covering an entire area of the patterned slot. The structure reduces thermal energy loss through the substrate and the plurality of feature elements is configured to allow the incidental radio wave to pass through the slotted electrically conductive structure. A multilayer structure comprising the slotted electrically conductive structure and a film structure having randomly distributed irregularly shaped protrusions or pits is also provided.


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