The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2022

Filed:

Sep. 11, 2020
Applicants:

Lite-on Opto Technology (Changzhou) Co., Ltd., Changzhou, CN;

Lite-on Technology Corporation, Taipei, TW;

Inventors:

Chen-Hsiu Lin, New Taipei, TW;

Chih-Yuan Chen, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/18 (2006.01); H01L 33/00 (2010.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 25/075 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 25/0753 (2013.01); H01L 33/486 (2013.01); H01L 2224/0801 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/80395 (2013.01); H01L 2224/80815 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A light emitting package is provided, the light emitting package includes a carrier having a main part that has multiple chip bonding regions, and each the chip bonding regions has two neighboring conductive parts. An insulating part is disposed on the main part and portion of the two neighboring conductive parts, and multiple hollow-out structures are formed by the insulating part and corresponded in position to the chip bonding regions. Each of the hollow-out structures has a side wall that surrounds the chip bonding regions, and the portion of the tops of the two neighboring conductive parts are exposed from a bottom portion of the hollow-out structure, and multiple light emitting chips are disposed onto the chip bonding surfaces.


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