The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2022

Filed:

Jun. 24, 2020
Applicant:

SK Hynix Inc., Gyeonggi-do, KR;

Inventors:

Sangmuk Oh, Gyeonggi-do, KR;

Kangseol Lee, Seoul, KR;

Assignee:

SK hynix Inc., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01); G01R 31/26 (2020.01); H01L 25/065 (2006.01); H01L 23/538 (2006.01); G01R 31/317 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); G01R 31/2831 (2013.01); G01R 31/2851 (2013.01); G01R 31/2884 (2013.01); G01R 31/2886 (2013.01); G01R 31/31717 (2013.01); H01L 23/5384 (2013.01); H01L 23/5385 (2013.01); H01L 2924/00 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/14 (2013.01);
Abstract

A stacked semiconductor device may include: a base die; and a plurality of core dies stacked over the base die and coupled to each other through a plurality of through-electrodes and a reference through-electrode, wherein the base die includes a first test circuit suitable for transferring a test oscillating signal to at least one target through-electrode among the through-electrodes, and outputting a test output signal by comparing a test base signal generated based on the test oscillating signal, with a test core signal transferred through the reference through-electrode, during a test operation; and wherein each of the core dies includes a second test circuit suitable for generating the test core signal corresponding to the test oscillating signal transferred through the target through-electrode, and transferring the test core signal to the reference through-electrode, during the test operation.


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