The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2022
Filed:
Dec. 30, 2020
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Yuki Sato, Saitama, JP;
Kenji Otake, Nagano, JP;
Takafumi Ando, Oita, JP;
Jeffrey Morroni, Parker, TX (US);
Charles Allen Devries, Jr., Winfield, IL (US);
Kristen Nguyen Parrish, Dallas, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01L 49/02 (2006.01); H01L 23/31 (2006.01); H01L 21/78 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/645 (2013.01); H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/3107 (2013.01); H01L 23/4952 (2013.01); H01L 28/10 (2013.01);
Abstract
An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate and the substrate-based coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the substrate-based coil and the electronic component.