The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2022

Filed:

Jan. 07, 2020
Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventor:

Nobuhide Arai, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); H05K 7/20 (2006.01); H05K 1/18 (2006.01); H01L 21/48 (2006.01); H01L 25/065 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 21/4878 (2013.01); H01L 25/0655 (2013.01); H01L 25/072 (2013.01); H05K 1/181 (2013.01); H05K 7/20854 (2013.01); H05K 7/20872 (2013.01); H05K 2201/10378 (2013.01);
Abstract

A semiconductor module comprising a semiconductor apparatus and a cooling apparatus, where: the semiconductor apparatus includes a semiconductor chip and a circuit board on which the semiconductor chip is mounted; and the cooling apparatus includes: a top plate on which the semiconductor apparatus is mounted; a jacket including a side wall connected to the top plate, a bottom plate connected to the side wall and facing the top plate, and a cooling pin fin extending in such a manner as to taper from the bottom plate toward the top plate, where at least the bottom plate and the cooling pin fin are integrally formed, and at least one of ends of the cooling pin fin is firmly fixed to the top plate; and a coolant flow portion defined by the top plate and the jacket and for flow of coolant.


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