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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11456201 B1

PDFFull Text
Date of Patent:
Sep. 27, 2022

Filed:

Mar. 08, 2021

Semiconductor substrate and method of manufacturing semiconductor device

Applicants:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;

Inventor:

Yoshiharu Takada, Nonoichi Ishikawa, JP;

Assignees:

KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;

TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION, Tokyo, JP;

Attorney:

Allen & Overy LLP

Primary Examiner:

Ahmed N Sefer

Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/288 (2006.01); H01L 21/304 (2006.01); H01L 23/498 (2006.01); H01L 23/13 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); H01L 21/288 (2013.01); H01L 21/304 (2013.01); H01L 23/13 (2013.01); H01L 23/49894 (2013.01); H01L 23/142 (2013.01); H01L 23/498 (2013.01);
Abstract

A semiconductor substrate according to an embodiment includes a substrate having a first substrate surface, the substrate having a first outer diameter; a metal layer provided on the first substrate surface, the metal layer having a second outer diameter smaller than the first outer diameter; a first adhesive tape having a ring shape, the ring shape having a third outer diameter smaller than the first outer diameter and larger than the second outer diameter, the ring shape having a third inner diameter smaller than the second outer diameter, the first adhesive tape having a first base material, the first base material having a first surface and a second surface opposed to the first surface, the first adhesive tape having a first adhesive layer provided on the first surface, the first adhesive tape being attached to the first substrate surface and the metal layer through the first adhesive layer; and a second adhesive tape having a fourth outer diameter smaller than the first outer diameter and larger than the third inner diameter, the second adhesive tape having a second base material having a third surface and a fourth surface opposed to the third surface, the second adhesive tape having a second adhesive layer provided on the third surface, the second adhesive tape being attached to the second surface and the metal layer through the second adhesive layer.

Find Patent Forward Citations

Takada, Yoshiharu. (2022). Semiconductor substrate and method of manufacturing semiconductor device (U.S. Patent No. 11456201). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11456201

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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