The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2022
Filed:
Mar. 03, 2014
Applicant:
Ngk Insulators, Ltd., Nagoya, JP;
Inventors:
Assignee:
NGK Insulators, Ltd., Nagoya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B32B 15/04 (2006.01); B32B 7/12 (2006.01); H01L 21/683 (2006.01); B32B 18/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67 (2013.01); B32B 7/12 (2013.01); B32B 15/04 (2013.01); B32B 18/00 (2013.01); H01L 21/67103 (2013.01); H01L 21/6833 (2013.01); Y10T 428/31522 (2015.04);
Abstract
A member for semiconductor manufacturing apparatuses, which includes a ceramic electrostatic chuck and a cooling plate bonded together with a thermosetting sheet, is provided. The thermosetting sheet is made of a cured epoxy-acrylic adhesive. The adhesive contains (A) an epoxy resin capable of hydrogen transfer type polyaddition, (B) an acrylate or methacrylate polymer, and (C) a curing agent.