The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2022
Filed:
Mar. 04, 2021
Honda Motor Co., Ltd., Tokyo, JP;
Tokyo Institute of Technology, Tokyo, JP;
Koji Sakui, Wako, JP;
Takayuki Ohba, Tokyo, JP;
HONDA MOTOR CO., LTD., Tokyo, JP;
TOKYO INSTITUTE OF TECHNOLOGY, Tokyo, JP;
Abstract
A semiconductor device according to the present invention is formed by a plurality of semiconductor chips laminated on a substrate which are connected via a through electrode penetrating in a lamination direction, in which the plurality of semiconductor chips include first semiconductor chipseach having memory blocks and a decoder and a second semiconductor chip having a logic circuit, the logic circuit includes one selection circuit connected to the decoder of all the first semiconductor chipsand configured to select addresses of a first memory blockA that stops input/output and a second memory blockB that performs input/output instead among the plurality of memory blocks, and the addresses of the selected first memory blockA and the selected second memory blockB are each common to all the first semiconductor chips.