The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2022

Filed:

Mar. 04, 2019
Applicant:

Seagate Technology Llc, Cupertino, CA (US);

Inventors:

Anusha Natarajarathinam, Bloomington, MN (US);

Yongjun Zhao, Eden Prairie, MN (US);

Hui Brickner, Savage, MN (US);

Dongsung Hong, West Lafayette, IN (US);

Assignee:

Seagate Technology LLC, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/127 (2006.01); G11B 5/105 (2006.01); G11B 5/31 (2006.01); G11B 5/40 (2006.01); G11B 5/00 (2006.01);
U.S. Cl.
CPC ...
G11B 5/1272 (2013.01); G11B 5/105 (2013.01); G11B 5/3136 (2013.01); G11B 5/3163 (2013.01); G11B 5/40 (2013.01); G11B 2005/0021 (2013.01);
Abstract

A method involves depositing a near-field transducer on a substrate of a slider. The near-field transducer comprises a plate-like enlarged portion and a peg portion. A first hard stop extending from the near field transducer and an air bearing surface is formed. A heat sink is formed on the enlarged portion and the first hard stop. A dielectric material is deposited over the near-field transducer and the heat sink. A second hard stop is deposited on the dielectric material away from the air bearing surface. The second hard stop comprises a recess corresponding in size and location to the heat sink. The method involves milling at an oblique angle to the substrate between the first hard stop and second hard stop to cut through the heat sink at the angle. The recess of the second hard stop increases a milling rate over the heat sink compared to a second milling rate of the dielectric away from the heat sink.


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