The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2022

Filed:

Jun. 13, 2019
Applicants:

Beijing Boe Display Technology Co., Ltd., Beijing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Ruiyong Wang, Beijing, CN;

Lianjie Qu, Beijing, CN;

Yun Qiu, Beijing, CN;

Hebin Zhao, Beijing, CN;

Yang You, Beijing, CN;

Jun Wu, Beijing, CN;

Ruizhi Yang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/13357 (2006.01); H05B 47/155 (2020.01); H01L 25/075 (2006.01); H01L 33/54 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); G02F 1/1335 (2006.01);
U.S. Cl.
CPC ...
G02F 1/133609 (2013.01); G02F 1/133603 (2013.01); G02F 1/133605 (2013.01); G02F 1/133621 (2013.01); H01L 25/0753 (2013.01); H01L 33/54 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H05B 47/155 (2020.01); G02F 1/133612 (2021.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A surface light source and a manufacturing method thereof and a liquid crystal display device. The surface light source includes a substrate; a plurality of light emitting diode dies arranged in an array along a row direction and a column direction on the substrate; a driving circuit on the substrate and electrically connected to the plurality of light emitting diode dies and the driving circuit being configured to control at least two of the plurality of light emitting diode dies to emit light independently of each other; and an encapsulation layer on a side of the plurality of light emitting diode dies away from the substrate. The encapsulation layer is a continuous film layer covering the plurality of light emitting diode dies.


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