The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2022

Filed:

Jul. 31, 2020
Applicant:

Compertum Microsystems Inc., Hsin-Chu, TW;

Inventor:

Francis Piu Man, Lexington, MA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01J 5/08 (2022.01); G02B 3/00 (2006.01); H04N 5/33 (2006.01); G01J 5/00 (2022.01);
U.S. Cl.
CPC ...
G01J 5/08 (2013.01); G02B 3/0062 (2013.01); H04N 5/33 (2013.01); G01J 2005/0077 (2013.01);
Abstract

A depth thermal imaging module, including a thermal imager array, which includes a plurality of at least two thermal imagers that capture thermal radiation of a wavelength of a scene from different viewpoints. Each thermal imager includes a thermal imager chip, a lens stack, and a focal plane with focal length f. The thermal imagers are separated by a baseline distance of 2h and depth measurement Z is performed on an object of interest based on Z=2hf/Δ where Δ is the difference in location of the object of interest between its location in the thermal image captured by a first thermal imager and the location of the object of interest in the thermal image captured by a second thermal imager and represents as an offset of the point on the focal plane of the first thermal imager and the second thermal imagers relative to their optical axis.


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