The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2022
Filed:
Dec. 05, 2019
GM Global Technology Operations Llc, Detroit, MI (US);
Selina X. Zhao, Rochester Hills, MI (US);
Xiaosong Huang, Novi, MI (US);
GM Global Technology Operations LLC, Detroit, MI (US);
Abstract
Methods for fabricating Class-A components (CAC) include providing a molding precursor which includes a first and second skin layer each including a fiber reinforcing material embedded in a polymer matrix, a third layer between the first and second skin layers and including a third polymer matrix and a filler material interspersed therein. The fiber reinforcing materials include a plurality of substantially aligned carbon fibers having a plurality of low strength regions staggered with respect to the second axis. The method includes disposing a molding precursor within a die, compression molding the molding precursor in the die, wherein the die includes a punch configured to contact the second skin layer, opening the die to create a gap between the punch and an outer surface of the second skin layer, and injecting a Class-A finish coat precursor into the gap to create a class-A surface layer and form the CAC.