The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2022
Filed:
Apr. 23, 2019
Fujifilm Corporation, Tokyo, JP;
Yoshiki Sakazaki, Kanagawa, JP;
Ikuo Takano, Kanagawa, JP;
Satoshi Wakamatsu, Kanagawa, JP;
Keio Okano, Kanagawa, JP;
Kenichiro Tamaki, Kanagawa, JP;
FUJIFILM Corporation, Tokyo, JP;
Abstract
Provided is a method of manufacturing a microneedle array in which an active ingredient is concentrated at a tip while an active ingredient content is guaranteed. In order to achieve the object, a method of manufacturing a microneedle array in which needle-like recessed portions of a mold are filled with a liquid to form one dose of a patch includes determining a filling amount of the liquid from a difference in mass of the mold before and after filling of the liquid, determining a filling state of the liquid in the mold filled with the liquid, sucking the mold in which the filling amount and the filling state of the liquid are determined to be normal from a rear face, and evaporating and drying a solvent of the liquid of the sucked mold.