The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2022

Filed:

Aug. 08, 2019
Applicant:

Ckd Corporation, Aichi, JP;

Inventors:

Ikuo Futamura, Aichi, JP;

Tsuyoshi Ohyama, Aichi, JP;

Norihiko Sakaida, Aichi, JP;

Assignee:

CKD CORPORATION, Aichi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/08 (2006.01); G06T 7/11 (2017.01); G01N 21/956 (2006.01); G06T 7/00 (2017.01); H05K 3/34 (2006.01); H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0817 (2018.08); G01N 21/95684 (2013.01); G06T 7/0006 (2013.01); G06T 7/11 (2017.01); H05K 3/341 (2013.01); H05K 3/3494 (2013.01); H05K 13/0469 (2013.01); G06T 2207/30152 (2013.01); H05K 2203/163 (2013.01); H05K 2203/166 (2013.01);
Abstract

A substrate inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder and a thermosetting adhesive applied on the substrate, the substrate inspection device including: an irradiator that irradiates the solder and the adhesive with light; an imaging device that takes an image of the irradiated solder and the irradiated adhesive; and a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group.


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