The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2022
Filed:
Dec. 26, 2017
Sugon Dataenergy(beijing) Co., Ltd, Beijing, CN;
Jisheng He, Beijing, CN;
Chen Wang, Beijing, CN;
Peng Zhang, Beijing, CN;
Hongjie Wu, Beijing, CN;
Jingnan Peng, Beijing, CN;
Xing Li, Beijing, CN;
Zhen Sun, Beijing, CN;
Xintao Cui, Beijing, CN;
SUGON DATAENERGY(BEIJING) CO., LTD, Beijing, CN;
Abstract
The present invention relates to a method for enhancing boiling performance of chip surface comprising steps of mounting a heat pipe directly above the surface of the chip, and forming a porous structure for increasing the vaporization core on an upper surface of the heat pipe. Performing an enhancing treatment in boiling of the upper surface of the heat pipe by mounting the heat pipe directly above the chip makes a temperature field of the boiling surface uniform, increases the boiling area and vaporization core, strengthens the boiling heat transfer, and reduces the core temperature of the chip.