The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2022
Filed:
Jul. 12, 2019
Applicant:
Nitto Denko Corporation, Osaka, JP;
Inventors:
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 3/02 (2006.01); H05K 3/10 (2006.01); H05K 3/22 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/544 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/425 (2013.01); H05K 1/02 (2013.01); H05K 3/10 (2013.01); H05K 3/22 (2013.01); H05K 3/02 (2013.01); H05K 2201/09209 (2013.01); H05K 2203/0228 (2013.01); H05K 2203/03 (2013.01); H05K 2203/14 (2013.01);
Abstract
A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.