The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2022
Filed:
Dec. 26, 2020
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Yuichiro Okuyama, Tokyo, JP;
Takeshi Oohashi, Tokyo, JP;
Hajime Kuwajima, Tokyo, JP;
Takashi Ohtsuka, Tokyo, JP;
Kazuhiro Yoshikawa, Tokyo, JP;
Kenichi Yoshida, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/16 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/162 (2013.01); H05K 1/0298 (2013.01); H05K 1/144 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10651 (2013.01);
Abstract
Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.