The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2022
Filed:
Mar. 19, 2020
Applicant:
Verily Life Sciences Llc, South San Francisco, CA (US);
Inventor:
Kedar Shah, San Francisco, CA (US);
Assignee:
VERILY LIFE SCIENCES LLC, South San Francisco, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/52 (2011.01); H01R 13/52 (2006.01); H01R 43/20 (2006.01); H05K 1/14 (2006.01); H05K 5/00 (2006.01); H05K 3/40 (2006.01); H05K 3/36 (2006.01); A61B 5/00 (2006.01); A61B 17/34 (2006.01); A61N 1/05 (2006.01); H01R 13/24 (2006.01); A61N 1/375 (2006.01); A61B 5/145 (2006.01); H01R 12/70 (2011.01); H01R 12/71 (2011.01); H05K 1/02 (2006.01); A61N 1/36 (2006.01); H05K 1/11 (2006.01); A61B 5/24 (2021.01);
U.S. Cl.
CPC ...
H01R 12/52 (2013.01); A61B 5/0031 (2013.01); A61B 5/14503 (2013.01); A61B 5/686 (2013.01); A61B 5/6846 (2013.01); A61B 17/3468 (2013.01); A61N 1/0551 (2013.01); A61N 1/3752 (2013.01); H01R 12/7082 (2013.01); H01R 12/714 (2013.01); H01R 13/2414 (2013.01); H01R 13/2421 (2013.01); H01R 13/521 (2013.01); H01R 13/5219 (2013.01); H01R 43/205 (2013.01); H05K 1/02 (2013.01); H05K 1/144 (2013.01); H05K 3/368 (2013.01); H05K 3/4007 (2013.01); H05K 3/4015 (2013.01); H05K 3/4038 (2013.01); H05K 5/006 (2013.01); H05K 5/0056 (2013.01); H05K 5/0095 (2013.01); A61B 5/14532 (2013.01); A61B 5/24 (2021.01); A61B 2560/063 (2013.01); A61B 2562/0209 (2013.01); A61B 2562/16 (2013.01); A61B 2562/227 (2013.01); A61N 1/3605 (2013.01); A61N 1/3754 (2013.01); H01R 2201/12 (2013.01); H05K 1/112 (2013.01); H05K 2201/0133 (2013.01); H05K 2201/042 (2013.01); H05K 2201/09163 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/10265 (2013.01); H05K 2201/10371 (2013.01); H05K 2201/10393 (2013.01); H05K 2201/10409 (2013.01); H05K 2201/2018 (2013.01); H05K 2201/2036 (2013.01);
Abstract
An implantable connector for connecting an electronics package and a neural interface is made by way of a compressible contacts (e.g., a spring) that physical contacts a corresponding exposed bond pad. The compressible contact is held in compression with the exposed bond pad using a mechanical coupler. The compressible contact is physically separated and electrically isolated from other contacts by way of a compressible gasket. The compressible gasket is also held in compression using the mechanical coupler.