The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2022

Filed:

Feb. 14, 2022
Applicants:

Tohoku University, Sendai, JP;

Canon Anelva Corporation, Kawasaki, JP;

Inventors:

Takehito Shimatsu, Sendai, JP;

Miyuki Uomoto, Sendai, JP;

Kazuo Miyamoto, Saitama, JP;

Yoshikazu Miyamoto, Saitama, JP;

Nobuhiko Katoh, Kawasaki, JP;

Takayuki Moriwaki, Kawasaki, JP;

Takayuki Saitoh, Kawasaki, JP;

Assignees:

TOHOKU UNIVERSITY, Sendai, JP;

CANON ANELVA CORPORATION, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); C23C 14/08 (2006.01); C23C 14/34 (2006.01); C23C 14/58 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); C23C 14/08 (2013.01); C23C 14/34 (2013.01); C23C 14/5893 (2013.01); H01L 24/32 (2013.01); H01L 24/29 (2013.01); H01L 2224/2957 (2013.01); H01L 2224/29186 (2013.01); H01L 2224/29188 (2013.01); H01L 2224/29541 (2013.01); H01L 2224/29687 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/8383 (2013.01); H01L 2224/83097 (2013.01); H01L 2224/83099 (2013.01); H01L 2224/83896 (2013.01);
Abstract

A bonded structure includes a first substrate; a second substrate placed opposite to the first substrate; an intermediate layer provided between the first substrate and the second substrate and including a first oxide thin film layered on the first substrate and a second oxide thin film layered on the second substrate; either or both of the first oxide thin film and the second oxide thin film of the intermediate layer being formed of oxide thin films having increased defects; and an interface between the first oxide thin film and the second oxide thin film=being bonded by chemical bonding, and the interface comprising a low-density portion whose density is lower than that of the two oxide thin films.


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